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dc.contributor.authorAoki, Toshiki
dc.contributor.authorTachi, Tomohiro
dc.contributor.authorKonakovic Lukovic, Mina
dc.date.accessioned2026-01-14T20:58:31Z
dc.date.available2026-01-14T20:58:31Z
dc.date.issued2025-12-14
dc.identifier.isbn979-8-4007-2137-3
dc.identifier.urihttps://hdl.handle.net/1721.1/164532
dc.descriptionSA Conference Papers ’25, Hong Kong, Hong Kongen_US
dc.description.abstractThe miniaturization of shell structures presents a versatile and complex challenge, bridging geometry with diverse practical applications. In this paper, we introduce a novel approach for computing origami crease patterns to compress arbitrary 3D shell objects. First, we employ the adapted Material Point Method (MPM) to simulate the compression of a target surface and obtain an initial folded configuration. Since MPM produces overly smooth curved surfaces, their crease patterns are unsuitable for practical origami fabrication. We then propose a novel Folding Line Extraction (FLE) method that optimizes these smoothed surfaces to extract folding lines that achieve the target compression with minimal deformation and stretching outside the crease lines. This method produces smooth curved folding lines. Fabrication and experimental validation of the extracted patterns demonstrate their effectiveness and applicability in real-world scenarios.en_US
dc.publisherACM|SIGGRAPH Asia 2025 Conference Papersen_US
dc.relation.isversionofhttps://doi.org/10.1145/3757377.3763983en_US
dc.rightsCreative Commons Attributionen_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_US
dc.sourceAssociation for Computing Machineryen_US
dc.titleDiscovering Folding Lines for Surface Compressionen_US
dc.typeArticleen_US
dc.identifier.citationToshiki Aoki, Tomohiro Tachi, and Mina Konakovic Lukovic. 2025. Discovering Folding Lines for Surface Compression. In Proceedings of the SIGGRAPH Asia 2025 Conference Papers (SA Conference Papers '25). Association for Computing Machinery, New York, NY, USA, Article 98, 1–12.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.identifier.mitlicensePUBLISHER_POLICY
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2026-01-01T08:54:22Z
dc.language.rfc3066en
dc.rights.holderThe author(s)
dspace.date.submission2026-01-01T08:54:22Z
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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