Show simple item record

dc.contributor.authorKopell, Nancy
dc.contributor.authorScholvin, Jorg
dc.contributor.authorZorzos, Anthony Nicholas
dc.contributor.authorKinney, Justin
dc.contributor.authorBernstein, Jacob G
dc.contributor.authorMoore-Kochlacs, Caroline
dc.contributor.authorFonstad Jr, Clifton G
dc.contributor.authorBoyden, Edward
dc.date.accessioned2018-09-28T14:58:04Z
dc.date.available2018-09-28T14:58:04Z
dc.date.issued2018-08
dc.date.submitted2018-08
dc.identifier.issn2072-666X
dc.identifier.urihttp://hdl.handle.net/1721.1/118191
dc.description.abstractWe devised a scalable, modular strategy for microfabricated 3-D neural probe synthesis. We constructed a 3-D probe out of individual 2-D components (arrays of shanks bearing close-packed electrodes) using mechanical self-locking and self-aligning techniques, followed by electroless nickel plating to establish electrical contact between the individual parts. We detail the fabrication and assembly process and demonstrate different 3-D probe designs bearing thousands of electrode sites. We find typical self-alignment accuracy between shanks of <0.2° and demonstrate orthogonal electrical connections of 40 µm pitch, with thousands of connections formed electrochemically in parallel. The fabrication methods introduced allow the design of scalable, modular electrodes for high-density 3-D neural recording. The combination of scalable 3-D design and close-packed recording sites may support a variety of large-scale neural recording strategies for the mammalian brain.en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Award DP1NS087724)en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Grant R01NS067199)en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Grant 2R44NS070453-03A1)en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Grant 1R01NS102727)en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Grant 1R43MH101943)en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Grant 1R43MH109332)en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Grant 1R24MH106075)en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Grant R01DA029639)en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant DMS-1042134)en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant CBET-1053233)en_US
dc.description.sponsorshipUnited States. Defense Advanced Research Projects Agency (Grant HR0011-14-2-0004)en_US
dc.publisherMultidisciplinary Digital Publishing Instituteen_US
dc.relation.isversionofhttp://dx.doi.org/10.3390/mi9090436en_US
dc.rightsCreative Commons Attributionen_US
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en_US
dc.sourceMultidisciplinary Digital Publishing Instituteen_US
dc.titleScalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Platingen_US
dc.typeArticleen_US
dc.identifier.citationScholvin, Jörg et al. "Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating." Micromachines 9, 9 (August 2018): 436 © 2018 The Authorsen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Media Laboratoryen_US
dc.contributor.mitauthorScholvin, Jorg
dc.contributor.mitauthorZorzos, Anthony Nicholas
dc.contributor.mitauthorKinney, Justin
dc.contributor.mitauthorBernstein, Jacob G
dc.contributor.mitauthorMoore-Kochlacs, Caroline
dc.contributor.mitauthorFonstad Jr, Clifton G
dc.contributor.mitauthorBoyden, Edward
dc.relation.journalMicromachinesen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2018-09-21T07:11:57Z
dspace.orderedauthorsScholvin, Jörg; Zorzos, Anthony; Kinney, Justin; Bernstein, Jacob; Moore-Kochlacs, Caroline; Kopell, Nancy; Fonstad, Clifton; Boyden, Edwarden_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0003-4167-440X
dc.identifier.orcidhttps://orcid.org/0000-0002-8381-7555
dc.identifier.orcidhttps://orcid.org/0000-0002-5199-7627
dc.identifier.orcidhttps://orcid.org/0000-0002-8369-5308
dc.identifier.orcidhttps://orcid.org/0000-0002-0419-3351
mit.licensePUBLISHER_CCen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record