Advanced Materials for Micro- and Nano-Systems (AMMNS): Recent submissions
Now showing items 94-96 of 122
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Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees
(2003-01)Electromigration tests on different Cu dual-damascene interconnect tree structures consisting of various numbers of straight via-to-via lines connected at the common middle terminal have been carried out. Like Al-based ... -
Progress in Developing and Extending RM³ Heterogeneous Integration Technologies
(2003-01)This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounting with monolithic metallization) technologies for heterogeneous integration. Particular emphasis is placed on the APB ... -
Orientation of MgO thin films on Si(001) prepared by pulsed laser deposition
(2003-01)Pulsed laser deposition method was employed to grow MgO thin films with preferred orientation on bare Si(100) and SiO₂/Si(100) substrates. The orientation of MgO thin films was systematically investigated by varying ...
