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dc.contributor.authorSchmidt, Martin A.en_US
dc.contributor.authorO'Handley, Robert C., 1942-en_US
dc.contributor.authorRuff, Susanen_US
dc.coverage.temporalFall 2003en_US
dc.date.issued2003-12
dc.identifier6.152J-Fall2003
dc.identifierlocal: 6.152J
dc.identifierlocal: 3.155J
dc.identifierlocal: IMSCP-MD5-beaf56117a9c987185ba38d080bf124a
dc.identifier.urihttp://hdl.handle.net/1721.1/36872
dc.description.abstractIntroduces the theory and technology of integrated-circuit fabrication. Lectures and laboratory sessions on basic processing techniques such as diffusion, oxidation, epitaxy, photolithography, chemical vapor deposition, and plasma etching. Emphasis on the interrelationships between material properties, device structure, and the electrical behavior of devices. Provides background for thesis work in microelectronics or for 6.151. From the course home page: Course Description This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.en_US
dc.languageen-USen_US
dc.rights.uriUsage Restrictions: This site (c) Massachusetts Institute of Technology 2003. Content within individual courses is (c) by the individual authors unless otherwise noted. The Massachusetts Institute of Technology is providing this Work (as defined below) under the terms of this Creative Commons public license ("CCPL" or "license"). The Work is protected by copyright and/or other applicable law. Any use of the work other than as authorized under this license is prohibited. By exercising any of the rights to the Work provided here, You (as defined below) accept and agree to be bound by the terms of this license. The Licensor, the Massachusetts Institute of Technology, grants You the rights contained here in consideration of Your acceptance of such terms and conditions.en_US
dc.subjectmicroelectronicsen_US
dc.subjectMicroelectronics processingen_US
dc.subjectintegrated circuitsen_US
dc.subjectvacuumen_US
dc.subjectchemical vapor depositionen_US
dc.subjectCVDen_US
dc.subjectoxidationen_US
dc.subjectdiffusionen_US
dc.subjectimplantationen_US
dc.subjectlithographyen_US
dc.subjectsoft lithographyen_US
dc.subjectetchingen_US
dc.subjectsputteringen_US
dc.subjectevaporationen_US
dc.subjectinterconnecten_US
dc.subjectmetallizationen_US
dc.subjectcrystal growthen_US
dc.subjectreliabilityen_US
dc.subjectfabricationen_US
dc.subjectprocessingen_US
dc.subjectphotolithographyen_US
dc.subjectphysical vapor depositionen_US
dc.subjectMOSen_US
dc.subjectMOS capacitoren_US
dc.subjectmicrocantileveren_US
dc.subjectmicrofluidicen_US
dc.subject6.152Jen_US
dc.subject3.155Jen_US
dc.subject6.152en_US
dc.subject3.155en_US
dc.title6.152J / 3.155J Microelectronics Processing Technology, Fall 2003en_US
dc.title.alternativeMicroelectronics Processing Technologyen_US


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