MEMS Materials and Processes: a research overview

dc.contributor.author	Spearing, S. Mark
dc.date.accessioned	2003-11-10T19:49:43Z
dc.date.available	2003-11-10T19:49:43Z
dc.date.issued	2003-01
dc.identifier.uri	http://hdl.handle.net/1721.1/3667
dc.description.abstract	An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybrid structures, modeling of wafer bonding processes and development of high temperature fluid interconnections. Emphasis is placed on the key areas of materials science and engineering.	en
dc.description.sponsorship	Singapore-MIT Alliance (SMA)	en
dc.format.extent	1000149 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.relation.ispartofseries	Advanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subject	microelectromechanical systems	en
dc.subject	mechanical properties	en
dc.subject	process development	en
dc.subject	process modeling	en
dc.title	MEMS Materials and Processes: a research overview	en
dc.type	Article	en