Advanced Materials for Micro- and Nano-Systems (AMMNS): Recent submissions
Now showing items 118-120 of 122
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Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding
(2003-01)Direct wafer bonding has been identified as an en-abling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need ... -
A continuum theory of amorphous solids undergoing large deformations, with application to polymeric glasses
(2003-01)This paper summarizes a recently developed continuum theory for the elastic-viscoplastic deformation of amorphous solids such as polymeric and metallic glasses. Introducing an internal-state variable that represents the ... -
Computation and Simulation of the Effect of Microstructures on Material Properties
(2003-01)Many material properties depend on specific details of microstructure and both optimal material performance and material reliability often correlate directly to microstructure. In nano- and micro-systems, the material's ...
