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dc.contributor.authorWarren, James
dc.contributor.authorRead, Jake
dc.contributor.authorSeppala, Jonathan
dc.contributor.authorStrand, Erik
dc.contributor.authorGershenfeld, Neil
dc.date.accessioned2025-10-30T20:09:19Z
dc.date.available2025-10-30T20:09:19Z
dc.date.issued2025-07-31
dc.identifier.urihttps://hdl.handle.net/1721.1/163464
dc.description.abstractAdvanced materials hold great promise, but their adoption is impeded by the challenges of developing, characterizing, and modeling them, then of designing, processing, and producing something with them. Even if the results are open, the means to do each of these steps are typically proprietary and segregated. We show how principles of open-source software and hardware can be used to develop open instrumentation for materials science, so that a measurement can be accompanied by a complete computational description of how to reproduce it. And then we show how this approach can be extended to effectively measure predictive computational models rather than just model parameters. We refer to these interrelated concepts as “computational metrology.” These are illustrated with examples including a 3D printer that can do rheological characterization of unfamiliar and variable materials.en_US
dc.publisherSpringer International Publishingen_US
dc.relation.isversionofhttps://doi.org/10.1557/s43578-025-01651-2en_US
dc.rightsCreative Commons Attributionen_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_US
dc.sourceSpringer International Publishingen_US
dc.titleComputational metrology for materialsen_US
dc.typeArticleen_US
dc.identifier.citationWarren, J., Read, J., Seppala, J. et al. Computational metrology for materials. J. Mater. Res. 40, 2197–2203 (2025).en_US
dc.contributor.departmentMassachusetts Institute of Technology. Center for Bits and Atomsen_US
dc.relation.journalJournal of Materials Researchen_US
dc.identifier.mitlicensePUBLISHER_CC
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2025-10-08T14:39:08Z
dc.language.rfc3066en
dc.rights.holderThis is a U.S. Government work and not under copyright protection in the US; foreign copyright protection may apply
dspace.embargo.termsN
dspace.date.submission2025-10-08T14:39:08Z
mit.journal.volume40en_US
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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