Show simple item record

dc.contributor.authorXie, Yi
dc.contributor.authorLi, Yichen
dc.contributor.authorRangamani, Akshay
dc.date.accessioned2023-06-28T17:29:33Z
dc.date.available2023-06-28T17:29:33Z
dc.date.issued2023-06-27
dc.identifier.urihttps://hdl.handle.net/1721.1/150972
dc.description.abstractThe flexibility of intelligent behavior is fundamentally attributed to the ability to separate and assign structural information from content in sensory inputs. Variable binding is the atomic computation that underlies this ability. In this work, we investigate the implementation of variable binding via pointers of assemblies of neurons, which are sets of excitatory neurons that fire together. The Assembly Calculus is a framework that describes a set of operations to create and modify assemblies of neurons. We focus on the project (which creates assemblies) and reciprocal-project (which performs vari- able binding) operations and study the capacity of networks in terms of the number of assemblies that can be reliably created and retrieved. We find that assembly calculus networks implemented through Hebbian plasticity resemble associative memories in their structure and behavior. However, for net- works with N neurons per brain area, the capacity of variable binding networks (0.01N) is an order of magnitude lower than the capacity of assembly creation networks (0.22N). To alleviate this drop in capacity, we propose a skip connection between the input and variable assembly, which boosts the capacity to a similar order of magnitude (0.1N ) as the Project operation, while maintain its biological plausibility.en_US
dc.description.sponsorshipThis material is based upon work supported by the Center for Brains, Minds and Machines (CBMM), funded by NSF STC award CCF-1231216.en_US
dc.language.isoen_USen_US
dc.publisherCenter for Brains, Minds and Machines (CBMM)en_US
dc.relation.ispartofseriesCBMM Memo;142
dc.titleSkip Connections Increase the Capacity of Associative Memories in Variable Binding Mechanismsen_US
dc.typeArticleen_US
dc.typeTechnical Reporten_US
dc.typeWorking Paperen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record