https://hdl.handle.net/1721.1/5552 2026-04-04T12:50:05Z 2026-04-04T12:50:05Z Lienhard, John H. https://hdl.handle.net/1721.1/102357 2019-07-01T18:26:35Z 2003-03-01T00:00:00Z

A History of the MIT Heat Transfer Laboratory Lienhard, John H.

2003-03-01T00:00:00Z Hannemann, R.J. https://hdl.handle.net/1721.1/7315 2019-09-12T16:50:33Z 2003-05-01T00:00:00Z

Thermal control of electronics: Perspectives and prospects Hannemann, R.J. One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come.

2003-05-01T00:00:00Z Bar-Cohen, A. https://hdl.handle.net/1721.1/7314 2019-04-12T08:39:29Z 2003-05-01T00:00:00Z

Thermal management of electronics: Energy conversion issues Bar-Cohen, A.

2003-05-01T00:00:00Z Chu, R.C. Bar-Cohen, Avi Edwards, David Herrlin, Magnus Price, Donald Schmidt, Roger Joshi, Jogenda Chryser, George M. Garimella, Suresh Mok, Larry Sammakia, Bahgat Yeh, Lian-Tuu https://hdl.handle.net/1721.1/7313 2019-04-09T19:12:39Z 2003-05-01T00:00:00Z

Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers Chu, R.C.; Bar-Cohen, Avi; Edwards, David; Herrlin, Magnus; Price, Donald; Schmidt, Roger; Joshi, Jogenda; Chryser, George M.; Garimella, Suresh; Mok, Larry; Sammakia, Bahgat; Yeh, Lian-Tuu

2003-05-01T00:00:00Z Dresselhaus, M.S. https://hdl.handle.net/1721.1/7312 2019-09-12T19:43:05Z 2003-05-01T00:00:00Z

Nanostructures and energy conversion Dresselhaus, M.S. The unique properties of nanostructures associated with their low dimensionality give rise to new opportunities for research on nanoscale heat transfer and energy conversion. Inspired by Majumdar’s analysis of the novel aspects of heat, mass, and charge flow across the interface between hard and soft materials, some perspectives about research frontiers in nanoscale heat transfer and energy conversion are provided.

2003-05-01T00:00:00Z Lienhard, John H. https://hdl.handle.net/1721.1/7307 2019-09-13T02:04:41Z 2004-10-28T19:46:07Z

Rohsenow Symposium web page Lienhard, John H.

2004-10-28T19:46:07Z Chen, Gang https://hdl.handle.net/1721.1/7306 2019-09-12T12:04:01Z 2003-05-01T00:00:00Z

Nanoscale heat transfer and information technology Chen, Gang The summary from Goodson’s group on their recent work on heat transfer issues in the microelectronics and data storage industries illustrate the critical role of heat transfer for some areas of information technology. In this article, we build on their work and discuss some directions worthy of further research.

2003-05-01T00:00:00Z Goodson, K.E. https://hdl.handle.net/1721.1/7305 2019-09-12T11:06:59Z 2003-05-01T00:00:00Z

Microscale thermal engineering of electronic systems Goodson, K.E. The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University.

2003-05-01T00:00:00Z Deutch, J.M. https://hdl.handle.net/1721.1/7304 2019-04-12T08:39:28Z 2003-05-01T00:00:00Z

Comments on papers: Session on advanced energy systems Deutch, J.M.

2003-05-01T00:00:00Z Forsberg, Charles H. https://hdl.handle.net/1721.1/7303 2019-09-12T11:15:13Z 2003-05-01T00:00:00Z

Hydrogen Futures and Technologies Forsberg, Charles H. Concerns about the security of oil supplies and the environmental consequences of burning fossil fuels have transformed the idea of a hydrogen (H2) economy from science fiction into a political bipartisan vision of our energy future. The challenge is now one of economics and technology. In one context, we already have a rapidly growing H2 economy, driven by the need for increased supplies of H2 to convert more abundant lower-grade crude oils into clean liquid fuels. This development is creating the infrastructure for a global H2 economy and provides powerful incentives to develop better methods of H2 production. The H2 content of liquid fuels is a variable; thus, there is also the option to add additional H2 to conventional liquid fuels to create H2-enhanced fuels. This option increases the liquid fuel yield per barrel of oil, creates a greatly expanded H2 production infrastructure, and may provide the easiest transition to a full H2 economy. It is primarily the characteristics of H2 as a fuel, rather than the type of device in which it is used (fuel cell or internal combustion engine), that creates the environmental benefits of a H2-fueled economy at the point at which the device is used. Water is the only waste product of H2 fuel. The other potential benefits of a H2 economy require methods of production that do not depend upon foreign energy resources and greatly reduce emission of greenhouse gases to the environment. Consequently, the most important challenges are the development of better methods to produce H2 and to store (deliver) H2 onboard vehicles. While fuel cells are not required for a revolution in transportation (internal combustion engines can burn H2), they add another dimension to the H2 economy by their potential impacts on electricity production and distribution. Hydrogen fuel cells may provide a storable form of electricity to meet peak electric demands. This benefits high-capital-cost low-production-cost energy sources such as nuclear and renewables by providing a demand for their energy output that is not tied to the daily cycle of electricity demand. The methods to produce and store H2 define the technical challenges. These challenges, in turn, define the challenges in heat transfer—the subject of this Rohsenow Symposium. The likely characteristics of our transition to a H2 economy and some of the accompanying technical challenges in heat transfer are described herein.

2003-05-01T00:00:00Z Rosenfeld, Arthur H. https://hdl.handle.net/1721.1/7302 2019-04-09T16:12:19Z 2003-05-01T00:00:00Z

Improving energy efficiency 2-3%/year to save money and avoid global warming Rosenfeld, Arthur H.

2003-05-01T00:00:00Z Majumdar, Arun https://hdl.handle.net/1721.1/7301 2019-04-10T07:24:45Z 2003-05-01T00:00:00Z

Nanoscale transport phenomena at the interface of hard and soft matter Majumdar, Arun Hard and soft matter can be distinguished by the energy of chemical bonds in comparison with kBT. At the interface of hard and soft matter, there exists a region of transition between strong (covalent/ionic/metallic) bonds in solids and weak (van der Waals/hydrogen/electrostatic) interactions in liquids and polymers. Transport of energy and mass at such interfaces is yet to be fully explored, but seems both rich in science and of technological importance. This paper discusses some fundamental issues as well as some technological implications.

2003-05-01T00:00:00Z Amon, Cristina H. https://hdl.handle.net/1721.1/7300 2019-04-12T08:39:27Z 2003-05-01T00:00:00Z

MEMS-based thermal management of high heat flux devices edifice: Embedded droplet impingement for integrated cooling of electronics Amon, Cristina H. Increases in microprocessor power dissipation coupled with reductions in feature sizes due to manufacturing process improvements have resulted in continuously increasing heat fluxes. The ever increasing chip-level heat flux has necessitated the development of thermal management devices based on spray and evaporative cooling. This lecture presents a comprehensive review of liquid and evaporative cooling research applied to thermal management of electronics. It also outlines the challenges to practical implementation and future research needs. This presentation also describes the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100 W/cm2, employing latent heat of vaporization of dielectric fluids. Micro-manufacturing and MEMS (Micro Electro-Mechanical Systems) will be discussed as enabling technologies for innovative cooling schemes recently proposed. Micro-spray nozzles are fabricated to produce 50-100 micron droplets coupled with surface texturing on the backside of the chip to promote droplet spreading and evaporation. A novel feature to enable adaptive on-demand cooling is MEMS sensing (on-chip temperature, remote IR temperature and ultrasonic dielectric film thickness) and MEMS actuation. EDIFICE is integrated within the electronics package and fabricated using advanced micro-manufacturing technologies (e.g., Deep Reactive Ion Etching (DRIE) and CMOS CMU-MEMS). The development of EDIFICE involves modeling, CFD simulations, and physical experimentation on test beds. This lecture will then examine jet impingement cooling of EDIFICE with a dielectric coolant and the influence of fluid properties, micro spray characteristics, and surface evaporation. The development of micro nozzles, micro-structured surface texturing, and system integration of the evaporator will also be discussed.

2003-05-01T00:00:00Z Corradini, M.L. https://hdl.handle.net/1721.1/7299 2019-09-12T11:19:22Z 2004-10-26T17:01:19Z

Advanced Nuclear Energy Systems: Heat Transfer Issues and Trends Corradini, M.L. Almost 450 nuclear power plants are currently operating throughout the world and supplying about 17% of the world’s electricity. These plants perform safely, reliably, and have no free-release of byproducts to the environment. Given the current rate of growth in electricity demand and the ever growing concerns for the environment, the US consumer will favor energy sources that can satisfy the need for electricity and other energy-intensive products (1) on a sustainable basis with minimal environmental impact, (2) with enhanced reliability and safety and (3) competitive economics. Given that advances are made to fully apply the potential benefits of nuclear energy systems, the next generation of nuclear systems can provide a vital part of a long-term, diversified energy supply. The Department of Energy has begun research on such a new generation of nuclear energy systems that can be made available to the market by 2030 or earlier, and that can offer significant advances toward these challenging goals [1]. These future nuclear power systems will require advances in materials, reactor physics as well as heat transfer to realize their full potential. In this paper, a summary of these advanced nuclear power systems is presented along with a short synopsis of the important heat transfer issues. Given the nature of research and the dynamics of these conceptual designs, key aspects of the physics will be provided, with details left for the presentation.

2004-10-26T17:01:19Z Bar-Cohen, Avram https://hdl.handle.net/1721.1/7298 2019-04-10T20:50:29Z 2003-05-01T00:00:00Z

Thermal management of electronics: Energy conversion issues Bar-Cohen, Avram

2003-05-01T00:00:00Z Chu, Richard C. https://hdl.handle.net/1721.1/7297 2019-04-12T08:39:26Z 2003-05-01T00:00:00Z

Thermal management roadmap: Cooling electronic products from hand-held devices to supercomputers Chu, Richard C.

2003-05-01T00:00:00Z Hewitt, G.F. https://hdl.handle.net/1721.1/5565 2019-04-12T08:38:47Z 2003-05-01T00:00:00Z

BOILING ENHANCEMENT: RESPONSE TO PROFESSOR A. E. BERGLES Hewitt, G.F.

2003-05-01T00:00:00Z Bergles, Arthur E. https://hdl.handle.net/1721.1/5564 2019-04-11T02:44:52Z 2003-05-01T00:00:00Z

HIGH-FLUX PROCESSES THROUGH ENHANCED HEAT TRANSFER Bergles, Arthur E. Phase-change processes, such as pool and flow boiling, are generally very effective modes of heat transfer. However, the demands of modern thermal systems have required the development of methods to enhance boiling systems. While heat fluxes above 108W/m2 have been accommodated in carefully controlled situations, the required fluid and the convective conditions usually dictate maximum heat fluxes several orders of magnitude lower. Two major contemporary areas, enhanced surfaces for pool boiling and enhanced surfaces and inserts for forced convection boiling/vaporization, are discussed, as they facilitate the attainment of high heat fluxes. In addition to these passive techniques, active techniques and compound techniques are mentioned. The taxonomy of enhanced heat transfer is covered, and recommendations are given for future work.

2003-05-01T00:00:00Z Avedisian, C. T. https://hdl.handle.net/1721.1/5563 2019-04-09T16:39:32Z 2003-05-01T00:00:00Z

PHASE CHANGE HEAT TRANSFER – A PERSPECTIVE FOR THE FUTURE: RESPONSE TO PROFESSOR VIJAY K. DHIR Avedisian, C. T.

2003-05-01T00:00:00Z Dhir, Vijay K. https://hdl.handle.net/1721.1/5554 2019-04-12T08:38:45Z 2003-05-01T00:00:00Z

PHASE CHANGE HEAT TRANSFER – A PERSPECTIVE FOR THE FUTURE Dhir, Vijay K. During the last half of the twentieth century, significant advances have been made in developing an understanding of phase change heat transfer (e.g., boiling and condensation). Further advances in phase change heat transfer will continue to take place motivated by new technologies such as microelectronics, thermal management in space, advanced terrestrial and space power systems and processing of designed materials. In the past, because of the complexity of the processes, very often we have “oversimplified”, maybe out of necessity, the modeling of the processes. The resulting weaknesses in our models and correlations have continued to haunt us whenever we have encountered new applications. In order to address the phenomena from basic principles, in my opinion, we need to pay attention to processes occurring at nano to micro to macro scales, capitalizing on recent advances that have been made in experimental and numerical techniques. These phenomena include nucleation, evolution, merger and breakup of vaporliquid interfaces, contact line behavior; coupling of the bulk and surface features of the solid; and the role of nano and micro inhomogeneties and intermolecular forces between solid and liquid. Prediction of nucleate boiling transfer is taken as an example to demonstrate the value of coupling different scales in meeting the overall objective.

2003-05-01T00:00:00Z