Now showing items 1-5 of 5

    • 2.72 Elements of Mechanical Design, Spring 2006 

      Frey, Daniel; Smith, Amy (2006-06)
      Examination and practice in the application of many mechanical design elements, including control components. Students working in groups design, fabricate, and test prototype devices in response to requests from industrial ...
    • 4.173 Digital Mock-Up Workshop, Spring 2004 

      Sass, Lawrence (2004-06)
      This is an advanced subject in computer modeling and CAD CAM fabrication in building large-scale prototypes and digital mock-ups within a studio setting. Prototypes and mock-ups are developed with the aid of outside ...
    • 6.152J / 3.155J Microelectronics Processing Technology, Fall 2003 

      Schmidt, Martin A.; O'Handley, Robert C., 1942-; Ruff, Susan (2003-12)
      Introduces the theory and technology of integrated-circuit fabrication. Lectures and laboratory sessions on basic processing techniques such as diffusion, oxidation, epitaxy, photolithography, chemical vapor deposition, ...
    • Factory Flow Benchmarking Report 

      Kilpatrick, Auston; Quint, Mitch; Ramirez-de-Arellano, Luis G.; Schoonmaker, James (1996-12)
      The Lean Aircraft Initiative benchmarked representative part fabrications and some assembly operations within its member companies of the defense aircraft industry. This paper reports the results of this benchmarking ...
    • Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits 

      Leong, Hoi Liong; Gan, C.L.; Pey, Kin Leong; Tsang, Chi-fo; Thompson, Carl V.; e.a. (2005-01)
      Three dimensional (3-D) integrated circuits can be fabricated by bonding previously processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnects test structures ...